S3 Group’s long-standing relationship with TSMC continues to enable our mutual customers to develop optimised semiconductor solutions driven by our design expertise and leveraging from our large portfolio of Mixed-Signal IP across the numerous TSMC technology nodes.
ARM® Physical IP Platforms deliver process optimized IP, for best-in-class processor implementations. These platforms are comprised of logic libraries, memory compilers and interface IP. Collectively, they provide a powerful suite of design alternatives, offering System-on-Chip (SoC) designers the ability to balance performance, power, area and manufacturability throughout the design process. ARM leadership in microprocessor architectures, coupled with its Physical IP Platform, delivers optimal SoC designs and reduces time-to-market.
Creating Optimal Solutions through collaboration, S3 Group and Global Foundries, collaborate to deliver optimal semiconductor solutions that address our mutual customers’ application specific design challenges.
S3 Group collaborates with SMIC in creating high-performance, best-in-class data converters for consumer applications in technology nodes from 40nm to 28nm, enabling our mutual customers to develop ultra-low power, cost effective optimised SoCs for consumer and mobile markets.