Baseband to RF and more, in your own custom chip

We design and manufacture custom integrated circuits (ASICs) that ensure the seamless integration of analog and digital subsystems within your wired or wireless communications systems. We also go beyond the chip, providing total system software support in a world of multiple, evolving standards.

Decades of RF design experience, coupled with proven mixed-signal IP, mean fast, cost-effective chip development and assured performance, even in today’s electrically noisy environments.

Bills of materials reductions of up to 80% can be realized by shrinking communications boards onto custom chips. And by integrating as much as possible on-chip, you achieve superior noise performance, cut front-end power consumption, and significantly reduce variability in radio performance in volume production.


Iridium, a global provider of mobile satellite communications products tasked S3semi with developing its next generation integrated satellite M2M modem chip. The chip comprised:

  • Complete L-band transceiver
  • Integrated on-chip baseband DSP
  • Integrated on-chip power management
  • Multiple on-chip sensor interfaces
  • On-chip Frac-n synthesiser

The final chip was delivered on time and on budget with BoM savings exceeding the original target

“S3semi delivered a working IC design to us ahead of schedule. Their engineering expertise and skilled program management experience ensured higher levels of cost savings than we anticipated and enabled us to get our 9602 (full duplex shirt-burst data transceiver) to production and to market faster.”

David Schoen | CTO and Vice President of Product Development, Iridium Communications Inc.

Why use S3 Semiconductors?

S3semis’ integration excellence is based on:

  • Baseband to RF experience in satellite, consumer and wireless infrastructure
  • Design portfolio dominated by successful communications projects
  • Wide range of standards implemented
  • Extensive radio architecture expertise
  • Advanced power management experience
  • Mature IP to build most wireless communications transceivers
  • Proven track record of reducing bill of material costs in communications